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72 DESIGN007 MAGAZINE I MARCH 2025 Interview by Kelly Dack In a world where high-frequency commu- nication is becoming increasingly essential, understanding the factors that influence signal loss is crucial. As technology advances toward 6G and beyond, the management of signal loss through copper foil roughness in PCBs takes on new significance. Jaeyeol (Paul) Park, regional director of Nanya New Material Technology Co., gave a presentation at DesignCon focus- ing on the relationship between the crystalline structure of copper and its impact on signal integrity. I asked Paul to discuss his presenta- tion, and he explained how controlling grain size can enhance signal stability without sig- The Effect of Copper Crystal Structure on Signal Loss nificant alterations to existing manufacturing processes, paving the way for future advance- ments in telecommunications. Kelly Dack: Paul, can you give me a quick overview of your presentation on crystalline structure in copper and how that affects loss? Paul Park: One of the basic concepts is that high frequency, high signal speed is now increasing in the market, usually with 6G. But, at that point, the roughness of the copper foil in the PCB process influences some signal loss. We have been thinking about how to control and manage this signal loss to get a stable sig-