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@
atotech.com www.atotech.com
Transform your production
with InPro
®
SAP3
To find out more on InPro
®
SAP3, scan the QR Code to the right.
InPro
®
SAP3 – The revolu onary BMV filling process designed for insoluble
anode VCP systems with unmatched uniformity
With InPro
®
SAP3, MKS' Atotech sets a new standard for BMV filling in insoluble anode VCP systems.
The process provides customers with superior copper filling performance, fast throughput, and consistent
results even in demanding environments with current densities up to 3 A /dm². The unmatched rectan
gular line shape and copper uniformity has been proven in volume production at leading packaging
substrate manufacturers.
Try InPro
®
SAP3 now and increase your throughput and performance in vertical conveyorized package
substrate plating systems.
