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10 PCB007 MAGAZINE I MARCH 2025 Gold as a Key Component in PCBs and IC Substrates ATOTECH Gold has long been a cornerstone in the elec- tronics industry, particularly in the surface fin- ishing of PCBs and IC substrates. It provides essential surface protection while enabling various assembling techniques, such as sol- dering connections and wire bonding, using aluminum, gold, or copper wires. Gold plat- ing is a critical step in several finish systems, including electroless nickel/immersion gold (ENIG), electroless nickel/electroless palla- dium/immersion gold (ENEPIG), and elec- troless palladium/autocatalytic gold (EPAG). ese finishes are valued for their solderabil- ity and wire-bondability, with ENEPIG and EPAG offering enhanced solder joint reliabil- ity and gold-wire bondability. is article explores different types of elec- troless gold plating electrolytes, their plating mechanisms, and their properties and capabil- ities. We further connect the characteristics of gold to some key challenges of the electronics industry, such as high frequency, signal integ- rity, and fine feature demands. The Role of Gold-containing Final Finishes In the realm of electronics, final finishes play a crucial role. ey provide a protective layer on electronic components, preventing oxidation and corrosion that could lead to failures. With- out these finishes, the reliability and longevity of electronic devices would be significantly com- promised. Final finishes also enhance solder- Feature Article by Britta Schafsteller, Sandra Nelle, and Kuldip Johal