92 PCB007 MAGAZINE I MARCH 2025
TOP TEN
EDITOR'S
PICKS
IPC shared a statement
attributed to Dr. John W.
Mitchell, IPC president and
CEO on U.S. tariffs and their
implications on the global
electronics industry.
Statement from IPC, the Global
Electronics Association, on Recent
U.S. Tariffs and Global Trade
Ultra high density interconnect (UHDI)
technology is revolutionizing the
field of neurotechnology and brain-
computer interfaces (BCIs) by enabling
unprecedented levels of miniaturization,
complexity, and performance in neural
devices. Here's an in-depth look at how
UHDI contributes to these domains. Dense
Electrode Arrays–
UHDI technology is
a game-changer
for dense electrode
arrays used in
neurotechnology
and neuroscience
research.
UHDI Fundamentals: UHDI
Advances Neurotechnology
2024 Sustainability Highlights: IPC's Commitment to a Greener Future
In 2024, IPC's Sustainability for Electronics program made
significant impacts through multiple channels of engagement by
providing the industry with insights and tools needed to build
electronics better. IPC representatives shared expertise at industry
events, demonstrating how standards, education, and advocacy
support sustainability goals.
SMTA Provides Financial and
Mentorship Support for Students
of Manufacturing
The shortage of skilled workers in the
electronics manufacturing is one of today's
most pressing issues. So, it was not surprising
that the topic of workforce was present at
DesignCon this year as well.
EIPC 2025 Winter Conference,
Day 1: From Manufacturing to
Sustainability
The EIPC 2025 Winter Conference, Feb. 4-5, in
Luxembourg City, featured keynotes and two
days of conference proceedings. This is my
report of the first day's conference proceedings.
The first technical
session was introduced
and moderated by
Thomas Michels, CEO
of ILFA in Germany. The
theme of the session
was "Requirements for
manufacturability of
today's and future PCBs,"
and his first speaker was Martyn Gaudion, sales
and marketing director of Polar Instruments.
