Issue link: https://iconnect007.uberflip.com/i/1533339
MARCH 2025 I PCB007 MAGAZINE 9 Marcy LaRont is the managing editor of PCB007 Magazine and executive director of IPC Pub- lishing Group. Marcy started her career in PCBs in 1993 and brings a wide array of business experience and perspective to I-Connect007. To contact Marcy, click here. the unfortunate demise of the last copper foil manufacturing plant in the United States in his comprehensive article, "e Rise and Fall of Allied Signal Laminates," a more broadly illus- trative example than just for Allied Signal and Nippon Denkai. Ralph Jacobo of all4-PCB dis- cusses how his company is a pioneer in the important topic of substrate manufacturing. Dan Feinberg continues his IPC Hall of Fame series this month, spotlighting the one-and- only Walt Custer. Finally, I am excited to welcome Kurt Palmer and Simon Khesin of Schmoll America, who will be taking turns writing a new column. is month, Kurt recounts Schmoll's long history as an equipment and solutions provider in the industry, highlighting their continuous techno- logical development throughout the decades. As you read this, many of us are likely in the throes of IPC APEX EXPO 2025. e show floor and the robust programs and events that are taking place during this week make for their very own version of March Madness. I am looking forward to seeing many of you in the I-Connect007 booth—both on- and off-cam- era. Our Real Time with… IPC APEX EXPO coverage has expanded this year to include written articles and interviews in addition to the video spotlights you've come to look for- ward to—all covering the show. Stay tuned for lots of show coverage, now and in the coming weeks. You won't want to miss it. How can we serve you better? What do you want to read about? What are we covering well? What do we get right… or wrong? Your feedback is invaluable and helps us plan future issues. Please contact me at marcy@iconnect007.com and let's start a conversation. PCB007 In Episode 11 of I-Connect007's podcast, "Design- ing for Reality," guest Matt Stevenson focuses on the critical role of surface finishes in PCB manufactur- ing, particularly following the solder mask and leg- end process. Surface finishes are essential to pro- tect copper from oxidation and ensure effective sol- dering of components. With copper's tendency to oxidize rapidly, choosing the right surface finish is vital for maintaining solderability and extending the board's productive life. In this episode, Matt outlines five of the most common surface finishes used in PCB fabrication: Hot Air Solder Leveling (HASL); Electroless Nickel Immersion Silver (ENIS); Electroless Nickel Immer- sion Gold (ENIG) (Fun Fact: The most common sur- face finish in global PCB manufacturing today); and Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG). Why do you choose one over the other? What are the effects on solderability in assembly when the less common surface finishes are used? What about the high cost of gold? Where are we today with lead and lead-free products and environmental compli- ance issues? What about OSP? In what situations would you use three different surface finishes (yes, three!) on the same PCB? Ultimately, the choice of surface finish that the OEM and/or PCB designer chooses depends on a combi- nation of factors beginning with achieving the tech- nology capability and reliability required for that in- tended application and ending with the most viable option for overall package cost and what the mar- ket will bear. This podcast episode underscores the importance of thoughtful surface finish selection in enhancing PCB performance and longevity, as Matt adeptly answers all of these questions and more. If you like to listen and learn, this podcast is a good one. Listen here. On the Line With… ASC Sunstone Designing for Reality: Surface Finish