Issue link: https://iconnect007.uberflip.com/i/1533339
36 PCB007 MAGAZINE I MARCH 2025 Feature Interview by Marcy LaRont I-CONNECT007 Electroninks, a prominent player in parti- cle-free conductive inks, recently announced an exciting new range of metal-complex inks for ultra high density interconnect (UHDI) technology. At the SMTA UHDI Symposium in January, Mike Vinson, chief operating offi- cer of Electroninks, gave a presentation on this line of MOD inks, which are versatile and suit- able for a range of applications that require ultra-dense, miniaturized, and high-frequency technology. Mike says his technology is a game changer and will revolutionize UHDI circuit fabrication. Electroninks' MOD and iSAP Game Changers Marcy LaRont: Mike, would you give me a summary of your presentation at the SMTA UHDI symposium? Mike Vinson: UHDI technology is crucial for developing smaller, more powerful electronic devices. However, its widespread adoption faces several challenges. Our line of products has been developed to address some of these key challenges. Our metal-complex inks sim- plify manufacturing while improving perfor- mance and reliability. We absolutely believe that these materials are poised to redefine how UHDI circuits are fabricated.