Issue link: https://iconnect007.uberflip.com/i/1533339
ere are numerous factors at play in the science of electroplating or, as most oen called, electrolytic plating. One critical ele- ment is the use of organic addition agents and their role in copper plating. e function and use of these chemical compounds will be explored in more detail. Organic Addition Agents e organic addition agents serve several functions with respect to acid copper electro- deposits. First and foremost, they mediate the electrodeposition process by influencing sec- ondary current distribution (discussed in a previous column) and controlling the physi- cal properties of the copper deposit. e key physical properties of the deposit are tensile strength and elongation. What is the significance of tensile strength and elongation, otherwise known as ductility? During the normal performance of a printed circuit board, the copper deposit will undergo flexing. An example would be a satellite orbit- ing the globe, being intermittently heated and cooled as the device makes its way around the earth. e copper deposit within the PCB will undergo flexing, which leads to fatigue in the deposit. Cracking of the deposit within the bar- Trouble in Your Tank Feature Column by Michael Carano, IPC CONSULTANT Organic Addition Agents in Electrolytic Copper Plating 64 PCB007 MAGAZINE I MARCH 2025