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82 PCB007 MAGAZINE I MARCH 2025 Interview by Marcy LaRont In a rapidly evolving manufacturing land- scape, the shi toward substrate technology has become a focal point for some companies in the PCB industr y. Ralph Jacobo, technical sales and application engineer at all4-PCB, says the company has its roots in via-filling technology, has successfully navigated various market changes, and is now keenly focused on the demands of substrate manufacturing in North America. Ralph shares insights into the company's historical journey, current ini- tiatives, and the innovative steps being taken to address the complexities of modern sub- strate processes. Pioneering the Future of Substrate Manufacturing for North America Marcy LaRont: Ralph, tell us a little about the company's history and development. Ralph Jacobo: Our journey began with a heavy focus on via filling technology. In the early days, we recognized a growing demand for via- in-pad technology, which created a niche mar- ket for us. We developed partnerships with San-Ei and Tatsuta from Japan, offering non- conductive and conductive via filling mate- rials, respectively. ese early relationships were crucial in helping establish all4-PCB as a key player in the industry. We formed strong partnerships with MASS, GroupUp, and Pola & Massa, which became sta-