Issue link: https://iconnect007.uberflip.com/i/1533339
38 PCB007 MAGAZINE I MARCH 2025 Please explain what MOD stands for, how it works, and why this is a superior process. MOD is an acronym for metal-organic decom- position. MOD ink is particle-free, unlike the more standard nano-particle-based inks. Being particle-free gets you away from agglomera- tion, thus ensuring more uniform conductiv- ity. From a processing standpoint, it is versa- tile for fabricators because multiple deposition methods can be used with it, including inkjet, screen printing, and spray coating. It has a very high peel strength and performs exceptionally well in extreme conditions and environments, and the process itself eliminates a lot of liquid waste. We call it eco-friendly manufacturing. Tell me about your proprietary iSAP process, another part of Electronink's additive manu- facturing solution. is ink-based semi-additive process (iSAP) is an innovative alternative to conventional sub- tractive etching and electroless plating. e main benefit of this process to fabricators is that, by leveraging MOD inks as a seed layer, iSAP offers a lower overall cost to manufacture. It eliminates process steps, while also signifi- cantly reducing waste and power usage com- pared to traditional etching. It also allows the fabricator to achieve those very fine lines and features required with UHDI, and improves signal integrity and RF performance in high frequency circuits. We believe that iSAP is a true game changer in the landscape of building UHDI circuits. To what applications are you referring for these UHDI circuits? e primary UHDI markets are high-speed digital semiconductors and advanced pack- aging with fine-pitch metallization, wearable electronics and flex circuitry, and aerospace and automotive products. How are MOD and iSAP being received in the marketplace? For those working with UHDI and grappling with the many challenges of miniaturized elec- tronics, it is picking up traction. ere are a limited number of suppliers for UHDI technol- ogy and additive manufacturing. We are confi- dent in what we are seeing in the market. Beyond that, we are actively expanding the MOD ink portfolio to support next-generation UHDI and substrate technologies. rough our products and process solutions, we aim to accelerate UHDI adoption across consumer electronics, IoT, and industrial applications. That kind of expansion, and embracing sub- strate technology, shows high market confi- dence. Mike, is there anything else you would like to share? Because of the very limited supplier base in the UHDI manufacturing space, we have taken steps to secure the supply chain and ensure product availability for our customers. We have manufacturing facilities in the U.S., Tai- wan, and other partnerships worldwide that allow us to confidently make that commit- ment. is is an important part of our strategy for customer success. Mike, I look forward to hearing more as we move forward in this exciting and challenging time for PCB and EMS manufacturers. ank you for the opportunity, Marcy. PCB007 Mike Vinson