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68 PCB007 MAGAZINE I JULY 2025 Innovative Jig Design and Implementation of a Jig Tester Jigs play a crucial role in maintaining the precise distance between the cathode (substrate panel) and the anode during the copper plating pro- cess. This spacing is critical for preventing panel warpage, ensuring consistent copper thickness; furthermore,this plating system comes along with a jig tester for continuous monitoring of jig con- ditions, ensuring that clamp conductivity, force, and deformation are kept within optimal parame- ters, improving overall plating uniformity, improving yield, and alleviating the workload for operators. Improving High Hole-density Capabilities As PCB and package substrate technologies evolve, next-generation designs demand increased through-hole densities, which in turn require greater copper deposition within holes as compared to sur- face areas. Traditional fluid agitation systems are no longer sufficient. Sparger systems equipped with eductor nozzles are essential for effective wetting and chemical treatment processes; offset eductor nozzles on both sides facilitate optimal mass trans- port of copper into through-holes. Frequency-con- trolled pumps with high-flow capabilities offer flexi- bility for varying product specifications. While direct current (DC) plating remains effi- cient and cost-effective for most applications, pulse plating is increasingly preferred for sub- strates featuring: • High through-hole counts • Tighter pitch spacing • Greater aspect ratios In this study, the plating line utilized rectifiers from multiple suppliers, supporting a range of configura- tions from cost-effective to high-end systems. These were paired with advanced process control soft- ware, enabling precise pulse waveform and profile customization based on specific board designs. This level of control ensures that copper distri- bution remains uniform—even in the most demand- ing applications—thereby supporting the reliabil- ity and performance expectations of AI, HPC, and next-gen computing platforms. Automation and Integration of Industry 4.0 The equipment operates with an advanced automa- tion platform developed through extensive exper- tise, integrating control software along with SCADA (supervisory control and data acquisition) capabil- ities while supporting concurrent batch process- ing and vertical integration protocols such as SECS/ GEM and OPC-UA. The system software aligns with Industry 4.0 principles and is fully compati- ble with the Digital Factory Suite (DFS), which has been designed and developed by MKS' Atotech, for incorporating remote service capabilities along- side system integration features including Indus- trial Internet of Things (IIoT) functionalities and edge computing solutions. This promotes factory digitali- zation while optimizing production, process mainte- nance, control measures, and visualization. The DFS includes key features such as: • Remote equipment monitoring: A compre- hensive dashboard provides a complete overview of all tools, enabling monitoring and decision-making without leaving the office or interrupting operations. • Traceability: All data from various sources is combined into a single interface, offering detailed traceability down to each batch and individual PCB for efficient root cause analy- sis and actionable insights. ▼ F i g u re 7: E xa m p l e of u n i p o l a r p u l s e wavefo r m . ▼ F i g u re 8 : E xa m p l e of c o m p l ex p u l s e wavefo r m .