Issue link: https://iconnect007.uberflip.com/i/1537616
JULY 2025 I PCB007 MAGAZINE 69 • Prompt alerting: Real-time, user-configu- rable notifications for relevant tool events are sent, ensuring the right users receive prompt alerts via PC or mobile devices tailored to their priorities, thereby enabling faster deci- sion-making and issue resolution. • Advanced troubleshooting: Scalable dash- boards and alerts, combined with traceability, provide quick access to relevant data, help- ing teams diagnose and resolve problems more efficiently. • Preventive maintenance: Real-time hardware health monitoring is assured to detect early wear and tear, schedule maintenance, and manage spare parts effectively. • Control over chemistry consumption: Compre- hensive information about the consumption of each chemistry is created without a need to generate and export reports at each single tool and compute consumption manually. • Control over utilities consumption: Precise measurement, monitoring, and reporting on utility usage, giving customers full control over consumables and enabling precise cost planning. Results In the evaluation of pulse plating technology, a design of experiments (DOE) approach was employed to optimize process parameters. The results demonstrated significant improvements in plating uniformity and throwing power. For a chal- lenging board design with over 350,000 through- holes and an HHD-SF of 1.63, a surface thickness gap of just 0.99 µm was achieved, with throw- ing power reaching 164% in dense hole areas and 155% in the isolated hole area. In another design with over 850,000 holes and an HHD-SF of 1.7, a surface thickness gap of 3.73 µm was achieved, with throwing power reaching 172% in high-density areas and 144% in the isolated hole area. ▼ F i g u re 9 : P l at i n g re s u l t of b o a rd 1 w i t h H H D -S F > 1 .6 a n d ove r 3 5 0,0 0 0 h o l e s p e r p a n e l . ▼ F i g u re 1 0 : P l at i n g re s u l t of b o a rd 2 w i t h H H D -S F > 1 .7 a n d ove r 8 5 0,0 0 0 h o l e s p e r p a n e l . ▼ F i g u re 1 1 : C o m p a r i s o n of c o p p e r d i st r i b u t i o n of h i g h d e n s e pattern (left) and low dense pattern (right) with just a surface C u t h i c k n e s s g a p of < 2 µ m o n a p a n e l ( 51 0 m m × 51 5 m m ) .