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C O M M U N I T Y M A G A Z I N E 5 2 S U M M E R 2 0 2 5 IPC-A-600M Acceptability of Printed Boards This document describes the target, acceptable, and nonconforming conditions that are either externally or internally observable on printed boards. It represents the visual interpretation of minimum requirements set forth in various printed board specifications, e.g., IPC601X series, JSTD003, etc. The visual illustrations in this document portray specific criteria of the requirements of the current IPC specifications. To properly apply and use the content of this document, the printed board shall comply with the design requirements of the applicable IPC222X series doc- ument and the performance requirements of the applica- ble IPC601X series document. IPC-2591 V2.0 Connected Factory Exchange (CFX) This standard establishes the requirements for the omnidi- rectional exchange of information between manufacturing processes and associated host systems for assembly manu- facturing. This standard applies to communication between all executable processes in the manufacture of printed board assemblies—automated, semiautomated, and manual—and is applicable to related mechanical assembly and transactional processes. IPC-2591 V2.0 provides a true ''plug and play'' Internet of Things (IoT) communication environment through- out manufacturing, where all equipment, manufacturing processes, and transactional stations can communicate with each other without the need for the development and use of bespoke interfaces. CFX-enabled equipment and solutions from different vendors work seamlessly together. IPC-4203C Cover and Bonding Material for Flexible Printed Circuitry This standard establishes the classification system, qualifi- cation, and quality conformance requirements for dielec- tric films coated with an adhesive on one or both sides, which are to be used as cover material and/or bondply for flexible printed circuitry and supported or unsupported adhesive films to be used in the fabrication of flexible printed circuitry. IPC-7530B Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow and Wave) This document provides useful and practical informa- tion for developing thermal profiles to produce accept- able SnPb and Pb-free electronics assemblies using reflow, vapor phase, laser, selective, and wave soldering equipment. The document also includes a troubleshoot- ing guide for addressing common defects that can be attributed to profiling. IPC-8911 Requirement for Conductive Yarns for E-Textiles Applications This standard identifies categories and establishes a des- ignation system and qualification/quality conformance requirements and test methods for conductive yarns used in e-textiles. The standard enables suppliers of conduc- tive yarns to demonstrate their products' performance against real-world processing and end-use environments, leveraging eight IPC Test Methods developed specifically for conductive yarns. IPC-8981 Quality and Reliability of E-Textiles Wearables This standard defines classification levels and testing thresholds to assess the reliability of e-textile wearables in their intended end-use environments. It establishes baseline criteria for evaluating durability under mechanical stressors, such as abrasion, flexing, and UV exposure, and environmental conditions, including perspiration, washing, water/saltwater, alkalis, and acids. Supported by 14 IPC Test Methods developed specifically for e-textile prod- ucts, the standard also provides guidance for identifying affected and critical areas for reliability testing. To view a complete list of published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, CLICK HERE. Standards Update