Issue link: https://iconnect007.uberflip.com/i/1539509
12 PCB007 MAGAZINE I SEPTEMBER 2025 to 0.0065. They optimize performance across a broad spectrum of signal speeds and bandwidth requirements. Com- mon applications include probe cards, embedded IC substrates, interposers, chip packaging, any-layer HDI designs, high- performance motherboards, server backplanes, and cellular network power amplifiers. In all cases, Pro-Bond maintains stable dielectric performance, ensuring consistent signal paths—essential for designs operating at tens of gigahertz or higher. Thermal-bond: High-conductivity Thermal Management Where heat dissipation is a primary constraint, thermal-bond delivers outstanding thermal con- ductivity—3.2, 7.0, or 9.0 W/mK—along with a high MOT of 155°C. These properties make them ideal for motor control systems, high-power RF amplifiers, embedded packaging, thermal interface materials (TIMs), and advanced multilayer IMS boards. By removing the thermal bottleneck of glass reinforce- ment, thermal-bond creates a direct thermal path from heat-generating components into heat spread- ers, metal cores, or chassis, dramatically improving performance without sacrificing structural integrity. Why Non-reinforced Matters At high frequencies, glass reinforcement becomes a liability. Variations in the weave cause micro Dk fluctuations that distort signal propagation and cre- ate skew between differential pairs. In fine-line HDI designs where feature sizes approach the glass bundle dimensions, this variability is amplified, leading to unpredictable behavior. By eliminating glass fiber, pro-bond and thermal-bond remove skew issues at high frequencies, improve imped- ance uniformity, enable cleaner microvia forma- tion, and avoid CAF (conductive anodic filament) failures associated with glass pathways. They also bypass low-Dk glass shortages, ensuring supply without compromising performance. Application Advantages for OEMs and PCB Manufacturers Electrical Performance • Ultra-low Df for reduced insertion loss • Stable Dk for precise impedance control • Support for thin dielectrics (down to 10 μm), enabling higher layer counts and finer pitch Thermal Management • High W/mK conductivity for efficient heat spreading • Compatibility with metal-core, ceramic, and glass substrates • Elimination of thermal barriers from glass fiber Mechanical and Processing Benefits • Wide flow range for via and heavy copper gap filling • Adjustable flow rates for application needs, including cavity bonding • Strong adhesion to ceramics, metals, and other non-traditional substrates • Excellent thermal resistance, passing 5X at 288°C solder float • Is not brittle like legacy bondplys, improving manufacturability • Pliable, user-friendly material that allows for ease in separation from liner • Standard cold storage (no need to keep frozen so no need to thaw prior to usage) Design Flexibility • Compatible with embedded and passive components • Supports BGA size reduction for high-aspect- ratio designs • Works with conductive adhesives for special- ized interconnects Real-World Impact In high-speed networking, pro-bond ensures 56–112 Gbps signals maintain integrity across long backplanes without costly signal conditioning. In AI computing motherboards, ultra-low-loss and thin dielectric Pesh Patel