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• PCB007 Magazine — September 2025
• Contents — The Future is Now: Advanced Materials
• Additional Contents
• Marcys Musings — Advancing the Advanced Materials Disucssion
• Short — I-Connect007 Launches Advanced Electronics Packaging DIgest
• Feature Article — Driving Next-generation PCB Performance
• Driving Innovation — Mastering Panel Warpage
• Feature Article — New Laminate Materials to Meet Today's Challenges
• Short — The Printed Circuit Designer's Guide to…DFM Essentials, Chapter 4
• Feature Article — Is Glass Finally Coming of Age
• Feature Article — Low-loss, Low-CTE Materials Driving the Future
• Short — Wrinkles in Atomaically Thin Materials Unlock Ultraefficient Electronics
• American Made Advocacy — Congress Back From Break With Work To Do
• MilAero007 Highlights
• Feature Article — Engineering Breakthroughs in High-frequency Circuit Materials
• Feature Interview — Jiva Leading the Charge Toward Sustainable Innovation
• Interview — Transforming the Industry: Advint's Mission in Metallization
• The Chemical Connection — The Practice of Doing Business in Foreign Lands
• Feature Article — Advanced PCB Material Innovations
• Short — First Electronic-Photonic Quantum Chip Manufactured in Commerical Foundry
• Happy's Tech Talk #33 — Free Engineering Statistics Training With Free Software
• Short — North American PCB Industry Shipments Up 20.7% in July
• The Right Approach — Electro-Tek: A Williams Family Legacy, Part 1
• HOF Spotlight Series — Highlighting Dan Feinberg
• PCB007 Top 10
• Career Opportunities
• Educational Resources
• Masthead and Advertising Index