IPC International Community magazine an association member publication
Issue link: https://iconnect007.uberflip.com/i/1546209
AUGUST 2026 I I-CONNECT007 MAGAZINE 81 X-VeCS for Fine Pitch, Small Form Factor The principle of processing X-VeCS is similar to that of R-VeCS. For X-VeCS, we create one or multiple slots. In this case, we do so in the form of an X, but it can be done in any other shape. We form the slot, plate, and selectively remove parts of the slots to create individual contacts. There is flexibility in the number of contacts, the shape of the VeCS, the depth, the shielding shapes, etc. The differential signal connections are placed on the right side of the X, where the left side of the X is connected to the GND below. So, we have two different depths in the X. The X is shown as a full connection except that when finished, it will have two endpoints at the end of the signal slots. For the GND connection, we can leave the legs on so they can carry more current. Figure 10: The X-VeCS in a design example. Notice that we are varying the trace width and using different routing schemes. We are not showing the GND connections and GND shielding in these images. Overall, the IST testing yielded results equal to or better than those of PTH. All products had a depth of R-VeCS up to 3.0 mm and showed high reliability. X-VeCS HDI Process Technology for Small Pitch Devices Best Fit Applications for VeCS Though most of our work at NextGin has been per- formed on backplane type PCBs—large panels, very high layer counts, and thickness—we have begun lower layer counts and smaller form factor projects. As yet, we have not seen a limit in appli- cations using VeCS. Competing head-on with other HDI-type applications, VeCS benefits from fewer lamination and plating cycles, resulting in better yields overall. An additional benefit is that VeCS- constructed inner layers can be repaired in a man- ner similar to traditional PCB inner layers. Signal performance for traditionally constructed HDI PCBs and those constructed by VeCS is similar. Therefore, we can expect to see competition between the two technologies over the next few years: traditional HDI multiple-lamination-cycle build-ups and VeCS. It will come down to pricing and total cycle time. X-VeCS for Smaller Pitch Devices The reason we address inorganic materials is that these new materials are difficult to use, as no B- stage versions are available for building ELIC HDI- type constructions. We call these constructions N+1, adding one layer (one each side) per lamination cycle. This technology has some great advantages, but the problem of yield is a big one, as is writing off all that added value when a defect occurs. The same construction can be made with X-VeCS with less lamination, drill and plating cycles. Figure 9: The same construction in N+2. This construction required three lamination, drilling, and plating cycles. Figure 8: A traditional N+1 construction build-up on a 4-layer core requires five lamination, drilling, and plating cycles.