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www.atotech.com info-atotech@mks.com Adaptable electroless copper for advanced packaging applications To find out more about Printoganth MV TP3 series, scan the QR Code to the right. Printoganth® MV TP3 series – Precision, reliability, and performance across a wider thickness range Meet the Printoganth ® MV TP3 series from MKS' Atotech, an adaptable electroless copper platform designed for advanced packaging applications. The series supports a wide range of copper thickness requirements, and includes Printoganth ® MV TP3 for ultra-low thicknesses below 150 nm, Printoganth ® MV TP3 Mod for 150–250 nm, and Printoganth ® MV TP3 Mod2 for deposits above 250 nm. The series combines best-in-class bath initiation with zero dummy plating, excellent adhesion to low-roughness dielectrics, strong throwing power into BMV structures, and fine epitaxial crystal growth through bottom-up recrystallization. The result is a flexible, high-performance solution for next-generation advanced packaging manufacturing. If you're looking for greater flexibility in electroless copper deposition, look no further. Contact MKS' Atotech to learn how the Printoganth ® MV TP3 series can support your advanced packaging process.