Design007 Magazine

18 DESIGN007 MAGAZINE I JULY 2023 Feature Article by Kris Moyer IPC With the increasing shrinkage of modern electronics in both board size and product volume, it's becoming more difficult to mount components to the PCB surface and still meet volumetric requirements. To avoid chip-on- board (COB) processing, board cavities can help mitigate the Z-axis skyline volumetric issues and allow for components that would otherwise not fit within the skyline to be used. As the name implies, a cavity is the removal of some of the board material to expose traces and contact pads on inner layers of the PCB. is is done to allow attachment of the com- ponent to these exposed pads rather than pads on the surface of the PCB (Figure 1). To form Designing Cavities to Reduce Skyline Figure 1: A typical cavity as it appears in an ECAD software tool.

• Design007 Magazine — Juy 2023
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• Feature Article — Designing Cavities to Reduce Skyline
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• Short — Toward a European Chips Act
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