Issue link: https://iconnect007.uberflip.com/i/1503357
46 DESIGN007 MAGAZINE I JULY 2023 IBM is a leading provider of advanced semi- conductor technologies and is actively work- ing on chiplet technology. e company has developed a chiplet-based architecture for its power processors and is also researching the use of chiplets in other applications. TSMC is a contract semiconductor manu- facturer and is actively researching and devel- oping chiplet technology. e company has announced plans to use chiplet-based archi- tectures in its future processors. Samsung is actively researching and devel- oping chiplet technology. e company has already released processors that use chiplet- based architectures. GlobalFoundries is a contract semiconduc- tor manufacturer and is actively researching and developing chiplet technology. e com- pany has announced plans to use chiplet-based architectures in its future processors. SK Hynix is a major provider of memory and storage solutions and is also actively research- ing and developing chiplet technology. Micron is a leading provider of memory and storage solutions and is actively researching and developing chiplet technology. plans to use chiplet-based architectures in its future processors. Huawei is a leading provider of telecom- munications equipment and is also actively researching and developing chiplet technol- ogy. e company has announced plans to use chiplet-based architectures in its future pro- cessors. Xilinx specializes in the design and devel- opment of FPGAs (field programmable gate arrays) and other types of programmable logic devices. With continued development and innova- tion, the electronics industry can expect to see more widespread use of chiplet concepts sooner than later. DESIGN007 References 1. "Chiplets and Heterogeneous Packaging Are Changing Design and Analysis," a white paper by John Park, Cadence Design Systems, 2020. Vern Solberg is an independent technical consultant, specializ- ing in SMT and microelectronics design and manufacturing technology. To read past columns, click here. On June 30, the Netherlands introduced new export restrictions on advanced semiconductor man- ufacturing equipment. Despite facing export controls from the US, Japan, and the Netherlands, TrendForce anticipates the market share of Chinese foundries in terms of 12-inch wafer production capacity will likely increase from 24% in 2022 to an estimated 26% in 2026. Moreover, if the exports of 40/28nm equip- ment eventually receive approval, there's a chance that this market share could expand even further, possibly reaching 28% by 2026. This growth poten- tial should not be dismissed. Several manufacturing processes including photo- lithography, deposition, and epitaxy will be subject to these recent export restrictions. The U.S. Export Administration Regulations (EAR) is primarily aimed at limiting China's growth in advanced process, rather than mature ones. Although export regulations from the U.S., Japan, and the Neth- erlands cover equipment used across both mature and advanced process generations, it's namely equip- ment used in 45nm to more advanced processes which will require inspection. Despite Export Ban on Equipment, China's Semiconductor Expansion in Mature Processes Remains Strong Qualcomm is active in the mobile chip mar- ket and is researching and developing chiplet technology. The company has announced