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34 DESIGN007 MAGAZINE I JULY 2023 • Parallel planes in multilayer PCBs exhibit multiple resonances, which increase the impedance and the EM radiation. • e best solution to dampen the plane resonance is to terminate the transmission line with an impedance-matching resistive element, along the board edges. DESIGN007 References 1. Beyond Design by Barry Olney: "Dampening Plane Resonance with Termination," "Plane Cavity Resonance," "Fringing Fields." 2. Signal and Power Integrity—Simplified, 3rd ed., by Eric Bogatin. 3. "Optimized Power Delivery Performance Using Plane Terminations," by Istvan Novak, Samtec. Pub- lished in 2020 IEEE 24th Workshop on Signal and Power Integrity (SPI). 4. US5708400A—AC coupled termination of a printed circuit board power plane in its character- istic impedance, Google Patents, Terrel Morris, Hewlett-Packard. Barry Olney is managing direc- tor of In-Circuit Design Pty Ltd (iCD), Australia, a PCB design service bureau that specializes in board-level simulation. The company developed the iCD Design Integrity software incor- porating the iCD Stackup, PDN, and CPW Planner. The software can be downloaded at www.icd.com. au. To read past columns, click here. By Alison James, IPC senior director, European government relations While the U.S. government has begun to imple- ment its CHIPS and Science Act, the European Union is deliberatively moving to issue its own leg- islation. Rising geopolitical tensions and the supply chain vulnerabilities exposed during the height of the COVID pandemic, followed by the Russian invasion of Ukraine, accelerated a move in the European Union now happening throughout all global regions: taking stock of strategic assets and vulnerabilities. Electronics and data, it seems, are the "oil" of the 21st century, and the high strategic importance of both elements focuses efforts to secure supply by building regional bases for high value-added activities and intensifying cooperation with strate- gic trading partners. The European Union's proposal for legislation regarding semiconductors was issued in February 2022 against the backdrop of global chip short- ages, a global "subsidy race" in the world's main producing regions, and a renewed EU industrial policy aiming to deliver on the bloc's ambitious digital and green transition. It is part of the region's evolving "strategic autonomy" agenda: reducing the continent's vulnerability to supply chain disrup- tions and geopolitical risks. At this time, the pro- posed legislation is in the final months of negotia- tion in the inter-institutional process under which European legislation is formed. With announcements of confirmed and rumored investments by well-known chip companies, it's clear that a leading intention behind the Euro- pean Chips Act is to attract high-end semiconduc- tor manufacturing to produce the most advanced chips. To read the rest of this article, which appeared in the Spring 2023 issue of IPC Community, click here. Toward a European Chips Act