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40 DESIGN007 MAGAZINE I JULY 2023 Integrating multiple chiplet elements on a single interposer or package substrate may be referred to as a multi-chip module, a hybrid IC, a 2.5D package, or simply an advanced pack- age. Implementing chiplet technology will provide several advantages over the traditional, system-on-chip alternative. Each chiplet ele- ment is designed to be a building block with a specific function that is oen common for mul- tiple system-level products. Chiplet elements can also be sourced from multiple providers, even though they may be using alternative fab- rication processes. Common goals that product developers strive to achieve are improving performance, simplifying assembly processing, and for the companies that are producing hand-held, por- table, and wearable electronics, minimizing product size. Achieving these objectives has PCB Designer's Guide to Heterogeneous Chiplet Packaging been made possible through advances in semi- conductor fabrication methods and innova- tive packaging technology. Until recently, the alternative to arranging and interconnecting individual semiconductor functions relied on integration, a process for combining multiple functions into a single "monolithic" die ele- ment. Developers found that by combining the CPU with all primary logic support utilities, a true heterogeneous system-on-chip (SoC) product was achievable. Technically, the SoC package accomplished two goals: Processing speed increased and it scaled down the over- all circuit board area by integrating several supporting functions within a single package outline. As the basic SoC morphed into the newer multiple core processor variations, the semi- conductor developers realized that they would Designers Notebook Feature Column by Vern Solberg, CONSULTANT