Design007 Magazine

Design-July2023

Issue link: https://iconnect007.uberflip.com/i/1503357

Contents of this Issue

Navigation

Page 55 of 81

56 DESIGN007 MAGAZINE I JULY 2023 Technologies Used to Manufacture Biosensors e process for manufacturing biosensors employs screen printing, laser cutting, lamina- tion, and adhesives. Screen printing of various conductive inks uses, but is not limited to, sil- ver, silver/silver-chloride, carbon, zinc, gold, dielectric, and more. In addition, the SMT process is used if components are required. ere are several key conversion processes, including die-cutting and lamination of medi- cal grade foams and adhesives, as well as the dispensing and placement of medical grade hydrogels and final packaging. rough-holes allow for connections between the top and bottom layer printed circuits and up to six lay- ers per side. In most applications, biosensor manufactur- ing involves a supply chain of companies since few companies possess all the necessary capa- bilities. ese capabilities include: • Circuit/electrode printing › Sheet or roll-to-roll › Typically, 2-5 print passes › Oven drying or UV curing aer each print pass › Oven dwell typically ≤10 minutes at ≤140°C › Slip sheet or interleaf may be required to prevent ink rub-off since carbon inks tend to be so and transfer to backside of substrate when stacked or wound in rolls › Routine in-process measurements to confirm conformance to agreed dimensional, ink thickness, and electrical specifications • Patterning of spacer/adhesive layer › One or combination of SRD, rotary, match metal, and/or laser • Patterning of lid or top layer › Same as spacer/adhesive • Dispensing and drying/conditioning of functional material › is is where most of the IP resides, and this step is oen performed by the OEM. is is changing as more medical converters are adding dispense capability in an effort to add value. • Laminating › Cold with pressure sensitive adhesive (PSA) or heated (hot melt) › Performed by OEM or converter • Option: Cartridge or cassette type configuration › Application may skip lamination process and instead die cut individual sensor circuits and install them into an injection molded plastic microfluidic cartridge or cassette. • Sheet/roll to cards › Large format cut down to rectangular card format (sensors nested 1 row x TBD across) for compatibility with commercially available strip singulation equipment. • Singulation › Individual sensors are typically slit from cards into individual test strips • Packaging › Singulated test strips placed in plastic vials, oen with inside walls lined with a desiccant. A screw or snap cap is installed, followed by application of label. DESIGN007 Rick Ramos is a marketing and inside sales engineer for Eastprint Inc.

Articles in this issue

Archives of this issue

view archives of Design007 Magazine - Design-July2023