92 SMT007 MAGAZINE I MAY 2024
In 2023, manufacturing investment in plants and other produc-
tion facilities in the United States rose nearly 63%, the biggest
yearly gain since 1951. This surge in investment underscores an
unparalleled confidence in the growth potential of the U.S. man-
ufacturing sector that looks beyond any short-term variability.
I-Connect007 is
pleased to announce
the launch of The
Printed Circuit
Assembler's Guide
to… Encapsulating
Sustainability for
Electronics by Beth
Turner at MacDermid Alpha Electronics
Solutions. The latest in a series of educational
books published by I-Connect007, this book
is an introductory guide to understanding
encapsulation resins and a tool for application
troubleshooting.
NextFlex Learning Programs, the educa-
tion-focused arm of the NextFlex® Hybrid
Electronics Manufacturing Innovation
Institute, announces its first spotlight effort,
"NextFlex Supports Women in STEM" to
increase the number of women in STEM
fields, which could accelerate U.S. GDP
growth by boosting women's cumulative
earnings by $299B and adding $5.9T to
the global stock market within 10 years
according to S&P Global.
Growth Potential: Electronics Manufacturing
Driving Massive Surge in Manufacturing
Investment
MacDermid Alpha Electronics
Solutions' New Book Now
Available for Download
NextFlex Announces $5M
Education Fundraising Effort:
First Spotlight—Transforming
the Landscape for Women in
Technology
TOP TEN
EDITOR'S
PICKS
In electronics manufacturing, the variety of component geometries
presents a challenge: differences in assembly height require a variable
throughput height in convection soldering systems. Current develop-
ments indicate a need for larger throughput heights due to the trend
towards e-mobility, which in turn increases nitrogen consumption for
process inertization. Rehm Thermal Systems responds to this issue
with an innovative solution: the mechatronic curtain.
Reducing Nitrogen Consumption in Convection Soldering With
Rehm Thermal Systems' Patented Mechatronic Curtain
