Issue link: https://iconnect007.uberflip.com/i/1526666
26 PCB007 MAGAZINE I SEPTEMBER 2024 2. More use of additive and semi-additive technologies will emerge in parallel with more gradual improvements in traditional subtractive PCB manufacturing. 3. As the need for speed continues to increase, specific novel concept alterna- tives will come into focus, namely, use of 10-year timeframe using technology readiness levels (TRLs). 3 For high-speed PCBs, solutions include: 1. Higher layer counts, thinner dielectrics, tighter line width control, better registra- tion, implementation of smoother copper, and alternative oxide process. Table 3: Issue: Power Distribution