Issue link: https://iconnect007.uberflip.com/i/1526666
50 PCB007 MAGAZINE I SEPTEMBER 2024 Essentially, the copper crystals cannot ori- ent themselves as one crystalline coating over another (i.e., substrate). I liken this situation to a "spongy"-looking deposit. As the grain of the metal lacks epitaxy, the copper grains are dis- organized and build up on other grains. is leads to a very weakened structure that will fracture. Getting to the root cause of an ICD requires deep knowledge of processes and the ability to understand upstream and downstream pro- cesses. is is a complex issue that requires knowledge of the mechanics of electroless copper and subsequent additional processes and how each relates to the success or failure of the interconnect. In a future column, I will explore Type 1 ICDs. PCB007 Michael Carano brings over 40 years of electronics industry experience with special exper- tise in manufacturing, perfor- mance chemicals, metals, semi- conductors, medical devices, and advanced packaging. To read past columns, click here. A large collaborative team led by the Univer- sity of Texas at Austin with Rice University as a key partner was awarded $840 million to develop the next generation of high-performing semiconductor microsystems for the U.S. Department of Defense. On July 18, the Defense Advanced Research Projects Agency (DARPA) selected UT's semicon- ductor consortium, the Texas Institute for Electron- ics (TIE), to establish a national open access R&D and prototyping fabrication facility to ensure Ameri- ca's national security and global military leadership. The facility will enable DOD to create higher per- formance, lower power, lightweight and compact defense systems. Such technology could apply to radar, satellite imaging, unmanned aerial vehicles or other systems. The new microsystem designs will be enabled by 3D heterogeneous integration (3DHI)—a semi- conductor fabrication technology that integrates diverse materials and components into microsys- tems using precision assembly technologies. As a member of DARPA's Next Generation Micro- electronics Manufacturing (NGMM) team, the Rice researchers led by Ramamoorthy Ramesh, execu- tive vice president for research, will focus on tech- nologies for improving computing efficiency. An internationally recognized leader in materials sci- ence and physics with applications to energy, Ramesh emphasized the urgent need to enhance energy-efficient computing, highlighting Rice's unique qualifications to contribute to the solution. The project represents a total investment of $1.4 billion. The $840 million award from DARPA is a substantial return on the Texas Legislature's $552 million investment in TIE, which has funded modernization of two UT fabrication facilities to strengthen long-term U.S. technology leadership. These facil- ities will be open to industry, aca- demia and government, and will cre- ate dual-use innovations supporting the defense sector and the semicon- ductor industry, including startups, advancing technology for the better- ment of society. (Source: Rice University) Rice Researchers Advancing Microelectronics Manufacturing on DARPA-funded Team