Issue link: https://iconnect007.uberflip.com/i/1526666
SEPTEMBER 2024 I PCB007 MAGAZINE 29 Woven-glass cloth. While improvements in woven-glass cloth technology have already been made, challenges in scale-up and cost structure remain. And while lower Dk glass fabrics and improved filament spreading have helped mitigate electrical skew issues due to Dk differences in the glass reinforcement vs. the polymer matrix, further improvements are needed, with non-woven reinforcements, unreinforced film-based dielectrics, and Dk adjustment of the polymer matrix as potential solutions. Signal layers. e substrate materials for the signal layers are generally epoxy films filled Table 6: Issue: Dielectric (IC and HDI)