IPC International Community magazine an association member publication
Issue link: https://iconnect007.uberflip.com/i/1527867
IPC COMMUNITY 88 FALL 2024 Jonathon Vermillion, BAE Space Mission Systems Quantum computing. It looks good doing it. Latha M.S., Kaynes Technology India Limited Electronics industry new technology. Kangle Li, CRRC Xi'an YongeJieTong Electric Co., Ltd. Design and reliability verification method of high power Sic driver. Zhaohua Hu, DISA Artificial Intelligence. Michael Davis, General Dynamics Electric Boat Additive manufacturing. Thomas Marktscheffel, ASMPT GmbH & Co. KG AI in electronics manufacturing. Hideo Goto, Sony Jisso quality. Toshiya Akimoto, Evident Methrology solution, microcopy, Electronics, Semiconductor, electrical device. Zachary Quick, Quick Turn Training and Consulting LLC Wireless technology. Karen McConnell, Northrop Grumman AI printed electronics wearable fabrics. Madelyn Treloar, PHYTEC AMERICA Medical and space but the topic in general is very interesting. Dana Korf, Nano Dimension 3D printed electronics and AME substrates/assemblies. Dennis Fritz, Fritz Technology Consulting The work on glass and even organic substrates to allow sub-25 micron conductors and insulators. This includes some traditional PC shops looking at glass substrates, like are being used for panel level packaging. Gene Weiner, Weiner International Associates UHDI and organic substrates, new materials, new equipment, new processes. Albert Block, Emerson/NI High performance overhead power lines with carbon nanostructures for transmission and distribution of electricity from renewable sources. Also, how this someday could be deposited to make PCBs. Paul Austen, Electronic Controls Design Inc. (ECD) Quantum computing. Roger Franz, TE Connectivity This is exciting: new materials for more sustainable electronic devices and packaging. While not yet ready for prime time, considerable R&D is showing the possibility of largely car- bon-based materials and use of nanotechnology to achieve highly functional active and passive components. Growth in new substrates like textiles, where IPC has released and contin- ues to develop standards, is also promising. These technologies will use fewer critical materials, limit the need for those in short supply, improve health and safety through use of fewer toxic substances, and help to complete a circular material cycle better than existing outdated electronics can ever do. Lim Ming, Jabil, Inc Photonics flash reflow soldering for the next generation of low-temperature material that has been using electrically conductive adhesive and PCBA. What Industry or Technology Advancement Excites You?