IPC COMMUNITY 46 FALL 2024
Standards Update
Newly Published Standards and Revisions
IPC-2294
Design Standard for Printed Electronics
on Rigid Substrates
IPC-2294 establishes specific requirements for the
design of printed electronic applications and their
forms of component mounting and interconnecting
structures on rigid substrates. Rigid substrates, as
applies to the IPC-2294 standard, are those that are
not required to be flexed into a new shape for the
purposes of assembly or operation. The rigid sub-
strate can be conductive (e.g., rigid printed board
or assembly), semiconductive, or nonconductive.
IPC-6904
Qualification and Performance Specification
for Printed Electronics on Rigid Substrates
IPC-6904 establishes and defines the qualifica-
tion and performance requirements for printed
electronics and their forms of component mount-
ing and interconnecting structures on rigid sub-
strates. The substrate can be conductive, semi-
conductive, or nonconductive.
IPC/Hermes-9852-v1.6
The Global Standards for Machine-to-Machine
Communication in SMT Assembly
IPC-Hermes-9852 provides a state-of-the-art
communication protocol for machine-to-machine
communication for surface mount technology.
Used with IPC-2591, Connected Factory Exchange,
IPC-Hermes-9852 can assist any electronics man-
ufacturer, large or small, to align their companies
with Smart manufacturing and Industry 4.0. Ver-
sion 1.6 includes updates to SendBoardInfo and
capabilities for Hermes-enabled equipment to be
queried on its Hermes capabilities.
IPC-J-STD-004D
Requirements for Soldering Fluxes
IPC-J-STD-004D prescribes general requirements
for the classification and characterization of fluxes
for high-quality solder interconnections. It may be
used for quality control and procurement purposes.
IPC-J-STD-005B
Requirements for Solder Paste
IPC-J-STD-005B lists the requirements for qualifi-
cation and characterization of solder paste. It ref-
erences test methods, criteria, and metal content,
viscosity, slump, solder ball, tack, and wetting of
solder pastes. Additional support is provided in
IPC-HDBK-005, Guide to Solder Paste Assessment.
IPC-4562B
Specification for Metal Base Copper-clad
Laminates for Printed Boards
IPC-4562A covers metal-unsupported foils and
foils supported by carrier films suitable for sub-
sequent use in printed boards. The standard
addresses the requirements of metal foils used in
printed wiring applications.
To view a complete list of newly published standards and standards revisions, translations,
proposed standards for ballot, final drafts for industry review, working drafts,
and project approvals, visit ipc.org/status
