IPC International Community magazine an association member publication
Issue link: https://iconnect007.uberflip.com/i/1527867
IPC COMMUNITY 58 FALL 2024 led to the issuance of the Automotive Adden- dum to J-STD-001/IPC-A-610 in 2021, establish- ing IPC-based solder appearance standards. The J-STD-001/IPC-A-610 Automotive Addendum Japan Regional Task Group (7-31BV-JP) was estab- lished in 2022 to encourage Japanese suppliers and companies to contribute actively to the IPC standards. This task group includes over 30 companies, such as Tokai Rika Co. A face-to-face meeting was held at Toyota Motor Corporation's Nagoya office in August 2024 to discuss pro- posed improvements to the standards. IPC Advanced Packaging Symposium and Government Collaboration Additionally, IPC hosted Advanced Pack- aging Symposium Japan, bringing together about 30 leading semiconductor and advanced packaging companies. The sym- posium featured presentations by Raja Swaminathan of AMD, Eiji Shimizu of METI, and IPC CTO Matt Kelly, who discussed the latest global trends and IPC initiatives. IPC also met with Akira Amari, a key member of the Liberal Democratic Party and a leader in Japan's semiconductor strategy, to discuss Advantech Japan IPC validation team, December 2023. Meeting with Mr. Amari, a member of the Liberal Democratic Party and a leader in Japan's semiconductor strategy, June 2024.