Issue link: https://iconnect007.uberflip.com/i/1533339
ple equipment lines for the via filling and pla- narization processes. As the demand for epoxy via fill PCBs grew over time, we pushed the boundaries of our knowledge and capabilities to continually provide solutions tailored to the North American market leveraging our strong partnerships with equipment manufacturers. In recent years, we've expanded our focus to meet the rising demand for substrate manufac- turing in North America. We're committed to staying ahead of the curve, bringing the latest technology from leading suppliers worldwide to ensure we continue to provide top-notch solutions for the North American market. Substrate manufacturing will be vital for the success of advanced packaging solutions How has all4-PCB transitioned into this space? It was a pretty natural progression for us. Given our extensive experience with via filling in the PCB space, we recognized that the processes for substrate manufacturing are quite similar, especially when it comes to sequential lamina- tion cycles and the use of build-up layers. In response to the growing demand, we dis- covered that our existing partners from Japan, Taiwan, and Europe were highly experienced in the substrate manufacturing process. is allowed us to expand our offerings and tap into a new and exciting field. One key differ- ence, though, is that substrate manufacturing requires even more attention to cleanliness, material handling, and preparation, especially due to the high-density microvias involved. Yes, cleanliness and material handling take on an entirely new level of importance in UHDI and substrate manufacturing. What do you offer to address this challenge? We're heavily involved in wet processing equipment, specifically surface pretreatment. is is crucial to ensure proper bonding to the dielectric layers, which is vital for achieving the high performance required in substrate manufacturing. We've partnered with Temgtai of Taiwan to offer specialized pretreatment lines. ese lines are compatible with MEC-ETCH and Atotech chemistries, both of which are highly sought aer in the industry for their effective- ness in pretreatment processes. How big are these lines? Where can a manu- facturer go to see one? ese lines are highly customizable, allow- ing them to be tailored to various production scales, from high-volume manufacturing to prototype development. Currently, most of these pretreatment lines are installed in Asia, but we are currently engaged with a few U.S. manufacturers as well. Do you support any other parts of the sub- strate manufacturing process? Yes, we do. Another critical process in substrate manufacturing is the application of the build-up layer, which is typically done with Ajinomoto (ABF) film. We've partnered with Nikko-Mate- rials from Japan to provide an advanced vacuum laminator that ensures extreme flatness dur- ing lamination, which is crucial for bubble-free adhesion. ese laminators are typically two- or three-stage inline systems that provide the high level of precision needed. Additionally, we work with GroupUp, also based in Taiwan, which offers a touchless clean- liness curing process. is process ensures that Ralph Jacobo 84 PCB007 MAGAZINE I MARCH 2025