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44 I-CONNECT007 MAGAZINE I JUNE 2026 TP, the mean values were well over 100% at the lower ARs and approached 90% across all features. Overall, the outcomes indicate a strong robust- ness in the plating process. The findings showed that excep- tional TP values could be achieved. In conclusion, this study effectively demon- strates the potential for superior throwing power performance using this system, indicating that effective metallization of HAR through-holes is achievable even at higher current densities. The unique design of the plating tool, which is compatible with GSE's closed- loop water recycling system, enhances sustain- ability while meeting the demands of modern production. To further optimize performance, the study's authors recommend refining both chemical parameters and physical settings to enhance throwing power. These results demonstrate the importance of advanced equipment and precise process control as the industry pushes the limits of high-performance electronics, particularly in AI and HDI technology. To test using controlled, symmetrically constructed DOEs, GSE is working on setting up a pilot line for customer use going forward. I-CONNECT007 Richard Nichols is technical marketing director at GreenSource Engineering. created unacceptable risk to production material and potentially triggered requalification require- ments, making parameter optimization impractical within the customer environment. It is noteworthy that in this case study, only a very limited amount of testing was conducted due to ongoing production pressure and limited machine availability. Trial opportunities were confined to short production gaps, preventing the execution of statistically meaningful test runs or iterative param- eter adjustments. Consequently, the overall evalua- tion scope was limited, and the ability to generate comprehensive process validation data was signifi- cantly reduced. The TP evaluation was carried out using assess- ments that adhered to IPC-TM-650 standards. Despite the limited evaluation scope, the study's results revealed several key insights. Although only three main variables were considered, the examination of TP across multiple microsections revealed an important finding: Higher aspect ratios require careful control of current density to ensure adequate plating quality. The results showed that while increasing the aspect ratio tended to decrease Figure 2: A cross-section of the test/R&D tool being honed to perfect an already robust equipment solution for HAR production.