IPC International Community magazine an association member publication
Issue link: https://iconnect007.uberflip.com/i/1545404
70 I-CONNECT007 MAGAZINE I JUNE 2026 F or decades, hardware development has often looked like a relay race: Work is handed from the mechanical team to the electrical team to the RF team, and eventually back again, hopefully without too many expensive surprises waiting at the finish line. But as products become smaller, faster, smarter, and far more complex, that old-school "over- the-wall" workflow is starting to show its cracks. Co-design is a more integrated, collaborative approach that promises to shrink design cycles, improve first-pass success, and maybe even save engineers from a few stress-induced headaches along the way. In this conversation, Kristin Moyer, a design instructor for the Global Electronics Association, explains the difference between concurrent and co-design, why the shift matters now, and how the future of hardware development may depend less on silos and more on everyone learning to work from the same digital playbook. From Concurrent to Co-design F E AT U R E I N T E RV I E W BY M A RCY L A RO N T, I - C O N N ECT 0 07 One Design, Many Minds