IPC International Community magazine an association member publication
Issue link: https://iconnect007.uberflip.com/i/1545404
4 I-CONNECT007 MAGAZINE I JUNE 2026 Old School Vs. New School Innovation rarely arrives without resistance. As PCB and systems technologies advance, engineers must decide which established practices still deliver results and which require a new approach. This issue explores the intersection of proven design principles and emerging methodologies, from AI and co-design to advanced packaging and ELIC technology. APRIL 2026 JUNE 2026 One Design, Many Minds: From Concurrent to Co-design with Kristin Moyer 70 48 68 79 85 Shorts The European PCB and Electronics Industries Score a Major Win in Chips 2.0 Milestone by Marcy LaRont Book Excerpt: The Printed Circuit Designer's Guide to… UV Curable Conformal Coatings Below the Surface From Nanometers to 10-Gauge: It's More Than Just a Wire by Chandra Gupta My Trip to Schneider Electric: AI, Data, and the Need for More Power by Marcy LaRont I-Connect007 Features Marcy's Musings 8 Old School vs. New School: When Does It Matter? by Marcy LaRont Features Elementary, Mr. Watson 76 Builders of the Dream by John Watson 80 The PCB Designer's Blind Spot: No Feedback, No Progress by Stephan Schmidt Beyond Design 86 Skip Layer Design: The Waveguide Structure That Makes 224G Possible by Barry Olney Designer's Notebook 92 Flip-Chip to Chiplets: The Evolution of System-Level Packaging by Vern Solberg 100 Transforming PCB Design from Reactive to Predictive With Digital Twins by Stephen Chavez Columns Target Condition 64 Signal Integrity Without Borders by Kelly Dack Connect the Dots 108 PCB Manufacturing Focused on Value by Matt Stevenson