IPC International Community magazine an association member publication
Issue link: https://iconnect007.uberflip.com/i/1545404
18 I-CONNECT007 MAGAZINE I JUNE 2026 The drive toward higher circuit density is challenging PCB manufacturers and their supply chains alike, with base materials as a critical foun- dation for complex designs. HDI designs present specific challenges and requirements for these ma- terials, but given the myriad possible designs and applications, there is no optimal "one size fits all" material. Perhaps the most challenging HDI designs are those that use stacked vs. staggered microvias, with the number of layers of stacked microvias and the pitch between them as critical variables. Staggered microvias are offset on adjacent layers with separate drill axes. They distribute mechanical stresses more evenly across a larger area and, there- fore, are generally more reliable. Stacked microvia designs enable more dense circuit routing but carry Base Material Properties and Microvia Reliability BY ED KELLEY, VICTORY GIANT TECHNOLOGY F E AT U R E A RT I C L E