IPC International Community magazine an association member publication
Issue link: https://iconnect007.uberflip.com/i/1545404
info @ atotech.com www.atotech.com AI server PCBs and advanced packaging require highest copper reliability Download our White Paper on this topic by scanning the QR code to the right. From microvia geometry to direct Cu-to-Cu integra on AI computing is accelerating the adoption of advanced packaging and high-density interconnect (HDI) architectures in PCBs, package substrates, and heterogeneous integration. Copper recrystallization behavior and nanovoid formation can become significant factors in everything from stacked blind microvia junctions (capture pad / electroless copper / electrolytic copper) to the fine-grained interfaces needed for hybrid copper- to-copper bonding. MKS' Atotech enables innovation by linking process controls to microstructure outcomes and quantifiable reliability indicators. This is supported by predictive metallographic screening using Normalized Crack Length (NCL) and is made possible through its unique combination of process chemistries and equipment platforms for MLB/HDI (mSAP), package substrates, and advanced packaging.