IPC International Community magazine an association member publication
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58 I-CONNECT007 MAGAZINE I JUNE 2026 BY D O N BA L L , C H E M C U T T H E C H E M I CA L C O N N ECT I O N This month's theme is every layer intercon- nect (ELIC) or every layer microvias (ELMV), a sub- ject that, I must confess, I have little practical knowl- edge of. The process problems here are mostly related to registration during multiple lamination steps and how to minimize or correct any misalign- ment. I know this is very difficult, but I suspect that if you are already doing this or considering it, you've probably figured it out on your own. So, when casting about for an alternative subject, it occurred to me that we have received several calls in the past few months from younger process people who have been thrust into more senior process positions as their older colleagues retire. They've realized they lack the practical knowledge their predecessors have accumulated over the years. They know what their various process param- eters are, but not why those particular parameters were in place. I thought that writing a Frequently Asked Ques- tions (FAQ) column would be a good idea, where I could cover some of the simple practical process Back to Basic Cupric Chloride Etching 58 I-CONNECT007 MAGAZINE I JUNE 2026