IPC International Community magazine an association member publication
Issue link: https://iconnect007.uberflip.com/i/1545404
8 I-CONNECT007 MAGAZINE I JUNE 2026 T he battle between old and new is noth- ing new. Throughout history, technological progress has faced skepticism, resistance, and at times, outright hostility. Yet progress tends to win. In his book, RenAIssance, author and APEX EXPO 2026 keynote Zack Kass illustrates this point beautifully. From hand weaving to sewing machines, from scribes to the printing press, from horse-drawn carriages to automobiles, and now to artificial intelligence, each technological leap has ultimate- ly made our lives more productive and expanded what was possible. Of course, disruptive change is rarely comfort- able. That's why it's important to separate genuine innovation from hype. This month, our contributors tackle that question as we explore old-school vs. new-school thinking in PCB and system design. Several authors argue that new approaches are not simply preferable; they are becoming neces- sary. In his column, Barry Olney says that as data rates push beyond 112G PAM4 toward 224G PAM4 and beyond, traditional stripline and microstrip geometries are reaching their limits. In some cases, the physics simply no longer cooperate. Columnist Matt Stevenson challenges traditional supplier-selection methods with the concept of total value management (TVM). Rather than focusing primarily on cost, TVM emphasizes collabora- tion, innovation, agility, and long-term partnership. The best manufacturing partners, he says, help customers navigate increasingly complex proto- typing and production decisions, whether domestic or offshore. Likewise, new contributor Pentalogix argues that the long-standing practice of "throwing designs over the wall" to fabricators is no longer sustain- able. Designers and manufacturers must communi- cate continuously for meaningful progress to occur. Kristin Moyer explores another shift in thinking through a discussion of concurrent design vs. co-design. While concurrent design allows multiple disciplines to work in parallel, co-design leverages integrated data environments that enable elec- trical, mechanical, RF, thermal, and other engineers to collaborate simultaneously. The result can be shorter development cycles, fewer revisions, lower costs, and higher first-pass success rates. Vern Solberg also lands firmly in the new-school camp by examining advanced packaging tech- nologies and the expanding role PCB designers BY M A RCY L A RO N T, I - C O N N ECT 0 07 OLD SCHOOL VS. NEW SCHOOL M A RCY 'S M U S I N G S When Does It Matter?