IPC International Community magazine an association member publication
Issue link: https://iconnect007.uberflip.com/i/1545404
10 I-CONNECT007 MAGAZINE I JUNE 2026 must play as electronic systems become increas- ingly integrated. Not everyone is ready to abandon traditional thinking, however. John Watson opens his column with Jean-Baptiste Alphonse Karr's famous observa- tion: "The more things change, the more they stay the same." While PCB design tools and technologies have evolved dramatically since the days of Mylar tape, Watson reminds us that the fundamental prin- ciples of good design remain remarkably consistent. Watson also expanded on this theme in a recent edition of Design007 Week, where he took a critical look at how to educate designers for the future. Stephen Chavez examines using digital twin in design. Kelly Dack continues his exploration of signal integrity influencers in the second part of his series on "Signal Integrity Without Borders," rein- forcing that while technologies change, the under- lying engineering disciplines remain essential. On the fabrication side, we explore one of the industry's newest frontiers: every layer intercon- nect (ELIC), sometimes called every layer microvia (ELMV). The technology is so new that the industry has yet to settle on a single name. Anaya Vardya of ASC introduces ELIC technology, explaining its capabilities, density advantages, and manufacturing challenges. Ralph Jacobo of all4- PCB discusses the critical role equipment tech- nology plays in supporting the multiple lamination cycles required for these advanced stackups. Mate- rials expert Ed Kelley rounds out the conversation by examining material selection, high-speed perfor- mance, and microvia reliability considerations in staggered and stacked microvia designs. Our PCB columnists cover a diverse set of topics. Don Ball tackles common etching questions and challenges the long-held assumption that faster is always better. Mike Carano examines insertion loss and signal distortion associated with final surface finishes, including the impact of roughness and nickel thickness on signal performance. Meanwhile, Shane Whiteside provides an update on the Printed Circuit Board and Substrates Act as it advances through Congress. Additional features include Richard Nichols' case study on achieving extremely high aspect ratios, Anaya Vardya looking at flex in medical technology and PCBs, and Sean Patterson has a practical roadmap for AI adoption within PCB manufacturing operations. We also celebrate EPTAC's new headquarters and long-standing contributions to industry training, and share highlights from my recent visit to Schneider Electric in Buffalo, New York, where I learned more about the AI-driven data center infrastructure reshaping the electronics supply chain. As you read through this issue, I encourage you to consider which ideas truly represent the future and which enduring principles still deserve a place in our toolbox. After all, progress is rarely about replacing everything that came before. More often, it's about knowing what to keep, what to improve, and what to leave behind. I-CONNECT007 Marcy LaRont is the managing editor of I-Connect007 Magazine and executive director of IPC Publishing Group. Marcy started her career in PCBs in 1993 and brings a wide array of business experience and perspective to I-Connect007. To contact Marcy, click here. M A RCY 'S M U S I N G S