I-Connect007 Magazine

STANDARDS DEVELOPMENT COMMITTEE MEETINGS IPC BUILDS 19-24 September 2026 H4 Wyndham Paris Pleyel, Paris, France The future of electronics manufacturing does not just happen — it is built by experts like you. Join industry leaders from around the world at IPC Builds 2026 to collaborate on the standards that drive quality, innovation, and reliability across the electronics industry. • Influence future standards • Share your expertise • Connect with global industry peers • Help shape what is next REGISTRATION IS NOW OPEN FOR IPC BUILDS 2026! Committee participation starts here! Register today at electronics.org/ipc-builds

• I-Connect007 Magazine — June 2026: Old School vs. New School
• Design007 Content
• PCB007 Content
• Marcy's Musings: Old School vs. New School When Does It Matter?
• Feature Article: Every Layer Interconnect The Promise, the Pain, and the Practical Limites
• Feature Article: Base Material Properties and Microvia Reliability
• Feature Interview: Building Better HDI Boards Driving Quality Through Lamination
• Trouble In Your Tank: At 40 GHz, Everything Matters Part 1
• Article: Don't Buy AI, Learn It A Fabricator's Guide to Getting Started Part 2
• Article: A Case Study in Conquering High Aspect Ratio Features
• American Made Advocacy: PCBs in the National Spotlight
• The European PCB and Electronics Industries Score a Major Win in Chips 2.0 Milestone
• Mil/Aero007 Highlights
• Feature Article: EPTAC The 'Ivy League' of High-tech Training
• EPTAC Celebrates New Expansive Training Center in New Hampshire
• The Chemical Connection: Back to Basic Cupric Chloride Etching
• Target Condition: Signal Integrity Without Borders
• Book Excerpt: The Printed Circuit Designer's Guide to…UV Curable Conformal Coatings: Addressing Future Manufacturing Speed and Need
• Feature Interview: One Design, Many Minds From Concurrent to Co-design
• Elementary, Mr. Watson: Builders of the Dream
• Below The Surface: From Nanometers to 10-Gauge: It's More Than Just a Wire
• Feature Article: The PCB Designer's Blind Spot No Feedback, No Progress
• My Trip to Schneider Electric: AI, Data, and the Need for More Power
• Beyond Design: Skip-Layer Routing The Waveguide Structure That Makes 224G Possible
• Designer's Notebook: Flip-Chip to Chiplets The Evolution of System-Level Packaging
• Article: Rewiring Medical Brain-Machine Communication With Flex PCBs
• Article: Transforming PCB Design from Reactive to Predictive With Digital Twins
• Connect The Dots: PCB Manufacturing Focused on Value
• I-007e Educational Resources
• Masthead and Advertiser Index