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JUNE 2026 I I-CONNECT007 MAGAZINE 35 In a future column, I will explore other final finish processes and materials for 40 GHz and beyond. References 1. "The Effects of PCB Fabrication on High Frequen- cy Electrical Performance," by John Coonrod, IPC APEX EXPO 2015. 2. "Insertion Loss Performance Differences to Plated Finish and Different Circuit Structures," by John Coonrod, IPC APEX EXPO 2023. Michael Carano brings over 40 years of electronics industry experience with special expertise in manufacturing, performance chemicals, metals, semiconduc- tors, medical devices, and advanced packaging. To read past columns, click here. modified nickel deposit (THP) with that of conven- tional nickel and copper. The modified ENIG (thinner deposit, smooth topography), while not as effective as immersion silver, nonetheless offers an alternative to conven- tional ENIG. This is due to the thinner nickel deposit, higher phosphorous content of the nickel deposit, and its non-magnetic properties. Another advan- tage is that the nickel deposit requires only 30–40 µins of plating thickness. That is much lower than conventional electroless nickel processes. The data compares insertion loss results on a microstrip test vehicle to a grounded coplanar waveguide (GCPW) designed test vehicle. Summary As AI and the Internet of Things (IoT) drive rapid technological change, processes and materials must keep pace. The electroless nickel-immersion gold process has served the industry well for many years, and a simple modification enables its continued use in higher-frequency applications. I-CONNECT007 T RO U B L E I N YO U R TA N K Figure 2: Insertion loss of thin high-phosphorous (modified) vs. conventional electroless nickel.