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SEPTEMBER 2024 I PCB007 MAGAZINE 25 Hotter and Greener New chipsets continually demand more power delivery with higher efficiency, leading to increased pressure to minimize losses in the PCB itself. Potential Solutions for High-Speed PCBs e roadmap also outlines potential solu- tions to address the needs, gaps, and chal- lenges that have been identified. e evolu- tion of these solutions is projected out over a Table 2: Issue: Size