IPC International Community magazine an association member publication
Issue link: https://iconnect007.uberflip.com/i/1527867
IPC COMMUNITY 75 FALL 2024 MOU Signing: IPC and PSDC/IPC and SHRDC A significant milestone was achieved with the signing of Memorandums of Understanding (MOUs) between IPC and two prominent Malay- sian organizations: the Penang Skills Develop- ment Centre (PSDC) and the Selangor Human Resource Development Centre (SHRDC). Special Session: Advanced Packaging in Semiconductor Technology This session, moderated by David Bergman, VP of standards and technology at IPC, focused on the critical role of advanced packaging in the semiconductor industry. Bergman emphasized the need for a strong industrial ecosystem to support technological advancements. The session featured two key presentations. Teng Chow Ooi of Intel Corporation explored how advanced packaging is pushing the frontiers of semiconductor technology. Takatoshi Ikeuchi of Resonac Corporation highlighted the impor- tance of evolving substrate materials to meet the demands of increasingly complex semiconductor devices. The session concluded with a panel discussion that underscored the importance of collabora- tive innovation and new material development to sustain the rapid advancements in the indus- try. Building a robust ecosystem will be essential for the future success of advanced packaging technologies.