IPC International Community magazine an association member publication
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IPC COMMUNITY 99 FALL 2024 Upcoming Events Looking ahead, IPC Asia has several major events planned: • Oct. 23-25: IPC Hand Soldering and Rework Competition Japan in Nagoya. • Oct. 24-25: IPC China Electronics Manufac- turing Annual Conference (CEMAC) in Shang- hai, with the theme "Make Your Imagination Reality." It will feature technical conferences, committee meetings, and special events, providing a high-efficiency, professional, and high-value international exchange platform. The event will be organized into six forums: e-Mobility, ESG, Design, Advanced Packag- ing, IC Substrates and PCBs, and Factory of the Future. • Oct. 29: IPC Korea Electronics Standards and Technology Festival (K-FEST) in Seoul will bring together industry peers to celebrate advancements and contributions in elec- tronics standards and technology. • March 26–28, 2025: IPC Masters Competi- tion China in Shanghai gathers the top technical talents from China's electronics manufacturing industry. Certification and Validations On Aug. 14-15, IPC China conducted a validation project at Magna Electronics (Zhangjiagang) Co., Ltd., making it the first company to undergo the IPC J-STD-001/IPC-A-610 Automotive Addendum QML. The initiation of this project marks a sig- nificant enhancement of IPC's service offerings for the automotive electronics industry. As more companies join this initiative, it is expected to positively impact the quality standards within the automotive sector, ultimately providing consum- ers with more reliable and safer vehicles. Education In August, IPC China welcomed two new edu- cation partners: Northwestern Polytechnical Uni- versity and Guangzhou Public Utility Technician College. In addition, the first student workshop in Thailand was successfully conducted at Suranaree University of Technology. On Aug. 30, the seventh IPC Asia Scholars Program, co-hosted by TTM and IPC Asia, concluded with 20 university students successfully completing the internship. Q3 Events On June 7, IPC hosted the Japan Advanced Pack- aging Symposium in Tokyo, bringing together leading experts, policymakers, and other stake- holders from the semiconductor industry to dis- cuss cutting-edge advancements and collabo- rative strategies shaping the future of advanced packaging technologies. The 2024 IPC Masters Competition China, held July 8–10, attracted nearly 400 top profession- als from 18 provinces and municipalities across China. The competition included the Hand Sol- dering and Rework Competition (HSRC), the Cable and Wire Harness Assembly Competition (CWAC), the Ball Grid Array/Bottom Termination Compo- nents Rework Competition (BGA/BTC), and the IPC Standards Knowledge Competition. IPC Hand Soldering and Rework Competitions took place, respectively, in Thailand and Malay- sia, in June and July. The winners will compete in the HSC world championship in November during electronica in Germany. IPC Hand Soldering and Rework Competition was held Sept. 11–13, 2024 in Hanoi, Vietnam.