IPC International Community magazine an association member publication
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IPC COMMUNITY 98 FALL 2024 • electronica (November): IPC will again be an exhibitor at the largest electronics event in Europe. The main attractions in our booth at Messe Muenchen will be the 2024 Hand Soldering Competition World Finals con- sisting of competitors from a dozen coun- tries including India, Malaysia, Australia, China, France, Hungary, Germany, and the United Kingdom; and the IPC Forum, which will spotlight 12 globally renowned subject matter experts who will share important knowledge and insights in the areas of sus- tainability, advanced packaging, Factory of the Future, and design. • Pan-European Electronics Design Confer- ence (January): We are partnering with FED to host an inaugural two-day technical con- ference in Vienna showcasing 24 papers on next-generation topics related to design for excellence, software tools, and process and product life cycles. • Southern Manufacturing & Electronics Show (February): IPC will launch the 2025 season for Hand Soldering Competitions in Farnborough, UK, at the annual exhibition that showcases new technology in machin- ery, production equipment, electronic production and assembly, and tooling. We look forward to meeting many of the OEMs whose technical staff regularly participate in IPC's standards development committees and numerous EMS companies who manu- facture PCBAs for UK aerospace and defense. • Global Industrie (March): IPC will exhibit in Lyon's "Electronics Village" to support France's largest industrial and manufactur- ing trade show. • IPC APEX EXPO (March): As part of IPC's global trade show, the IPC Europe staff will host our European volunteers at our annual Appreciation and Networking dinner. Contact PhilippeLeonard@ipc.org or Sanjay Huprikar@ipc.org if you have any questions about our activities. Asia By Sydney Xiao, President, IPC Asia In Q3, IPC Asia drove standards development and validation in the electronics manufacturing sector by expanding its educational collabora- tions, fostering the growth of student training programs, and hosting several competitions and industry conferences. Standards This year, major IPC standards have received intensive updates. The IPC Asia team is concen- trating efforts on translating these standards into local languages, including Chinese, Japanese, Korean, Thai, Vietnamese, and more. Notably, our technical group experts in South Korea are translating the glossary, which will lay a crucial foundation for future Korean standard transla- tions. Additionally, working drafts of several stan- dards are nearing completion, including IPC-6921, Requirements and Acceptance for Organic IC Sub- strate; IPC-6931, Requirements and Acceptance of Optical Module Printed Boards; and IPC-7077, Requirements and Acceptance of Wire Bonding in the Microelectronics Assembly.