Issue link: https://iconnect007.uberflip.com/i/1536435
48 PCB007 MAGAZINE I JUNE 2025 Accuracy and Quality Which technology offers higher accu- racy and better results? Direct imaging (DI) clearly outperforms conventional exposure. e latter depends heavily on the condition of phototools, which are sensitive to stor- age conditions and wear, making consistent, high-quality output difficult to maintain. However, DI eliminates these variables. It also simplifies top- to-bottom alignment, provid- ing much better precision. Con- sidering that current DI systems can achieve line/space resolu- tions as fine as 4/4 microns— or even 2/2 microns in some cases—the choice in terms of accuracy and quality becomes obvious. Technical Possibilities e elimination of phototools opens up strong digital advan- tages. Since the DI system receives the pattern digitally, it can easily scale, rotate, or shi the image during or just before the expo- sure—without the need for new tooling. For inner layers, updated scaling coefficients can be applied directly from the CAM department. For outer layers and solder mask, the sys- tem can automatically align to drilled fiducials or contact pads under the solder mask, elim- inating time-consum- ing phototool updates. Such possibilities are a must for current high- end board production. Another major advantage is the DI machine's integration with MES systems and traceability. It can read data-matrix codes, load the corresponding part program from a server or from MES, or generate and expose a unique code for each individual PCB. is improves traceability and process control. Figure 3: Line/space of 5/5 micron after exposure on Schmoll MDI-Ultra. Figure 4: Data-matrix code after direct imaging and development.