Issue link: https://iconnect007.uberflip.com/i/1536435
76 PCB007 MAGAZINE I JUNE 2025 WIJGMAAL, BELGIUM Editor's note: is is an excerpt om a technical paper presented at the inaugural Pan European Design Conference in January 2025. It is reflected as originally presented with minor edits for gram- mar. ere is a link to access the full paper at the conclusion of this excerpt. Abstract PCB manufacturing involves transforming a design into a physical board while meeting spe- cific requirements. Understanding these design specifications is crucial, as they directly impact the PCB's fabrication process, performance, and yield rate. One key design specification is copper thieving—the addition of "dummy" pads across the surface that are plated along with the features designed on the outer layers. e purpose of the process is to provide a uni- form distribution of copper across the outer layers to make the plating current density and plating in the holes more uniform. Copper electroplating is crucial in PCB man- ufacturing, primarily because it reduces ground line impedance and voltage drop. e perfor- mance of the electroplating process directly affects the quality of the copper layer and related mechanical properties. In acid copper plating, achieving proper thickness distribu- tion and surface uniformity without compro- mising metallurgical properties like elongation and tensile strength is challenging. Lowering the current density can help equalize copper thickness but significantly increases plating time, adversely affecting PCB throughput. erefore, controlling process performance and the quality of the electroplated copper Digital Twin Concept in Copper Electroplating Process Performance layer are vital aspects of PCB plating, which remains challenging even for experienced PCB manufacturers. Recognizing plating pro- cess performance in terms of copper layer coverage and thickness up front adds signifi- cant value to process design and control. is paper explores the concept of automated cop- per thieving and the digital twin of the cop- per plating process in PCB manufacturing. ese modern CAE tools facilitate the rapid assessment and mitigation of copper under- and over-plated surface areas, aligning closely with the principles of smart manufacturing. Introduction Copper electroplating: A critical step Copper electroplating is an electrochemical process of depositing a thin, uniform layer of copper onto the substrate of a printed circuit board and inside the plated through-holes 1 . Copper plating serves two main purposes: It increases the copper thickness of surface pads and conductors, while also establishing robust copper connections between layers. A well-managed and controlled copper plating process enhances the board's: • Electrical conductivity: Copper's supe- rior electrical conductivity supports effi- cient signal transmission and power dis- tribution across the PCB, ensuring the proper operation of electronic devices • Mechanical strength: Copper plating enhances the structural integrity of the PCB, particularly in through-holes and vias, providing durable and reliable inter- connections between the board's layers Article by Aga Franczak, Robrecht Belis, Elsyca N.V.,