PCB007 Magazine

PCB007-June2025

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60 PCB007 MAGAZINE I JUNE 2025 When we consider via reliability, the major contributing factors are typically process- ing deviations. ese can be subtle and not always visible. One particularly insightful column was by Mike Carano, "Causes of Plat- ing Voids, Pre-electroless Copper," where he outlined some of the possible causes of hole defects for both plated through-hole (PTH) and blind vias. Some of these causes are: • Poor drilling resulting in rough hole walls (many possible causes) • Non-optimized laser drilling for microvias (six different parameters to consider) • Improper material curing Other pre-metallization causes can be: • e desmear operation that is not in con- trol (the solvent conditioning, alkaline permanganate, neutralizer, and glass etch) • Inadequate textured Cu surface for palladium coverage ese can contribute to minimum or insuf- ficient metal coverage in the conductor via, resulting in partial voids that lead to prema- ture hole failure. For further discussion on this important topic, I will reference the work of a dear friend and colleague, Dr. Karl H. Dietz, a renowned Happy's Tech Talk #40 Feature Column by Happy Holden, I-CONNECT007 Factors in PTH Reliability: Hole Voids

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