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PCB007-June2025

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JUNE 2025 I PCB007 MAGAZINE 49 tion of more advanced PCBs, resulting in the potential for higher revenue. Addition- ally, improved yield and reduced defect rates mean less material loss, fewer reworks, and stronger customer satisfaction. Nevertheless, I would admit that, for sim- ple patterns with low resolution, conven- tional exposure might be justified. Productivity For dry film exposure, DI systems have reached speeds comparable to conventional exposure or even faster, especially with mod- ern resists optimized for DI. Due to higher energy requirements (and Figure 5: 4" dams of the solder mask. DI enables high levels of automation, allow- ing seamless integration into fully automated production lines. For inner layers, these lines could include everything from dry film pre- treatment to resist stripping. For outer lay- ers, the lines could run from dry film pre- treatment to development (depending on whether it's pattern or panel plating). Additionally, a DI system's autofocus fea- ture helps compensate for variations in panel thickness online during the exposure pro- cess, ensuring consistent imaging results across varying board conditions. Costs One might argue, "But conventional exposure is cheaper." Is it really? When you consider not only the exposure unit but also the plotter, film developer, film stor- age, dedicated space for phototool produc- tion, more cleanrooms, and the increased need for quality control, the total invest- ment may not be as different as it seems at first glance. DI systems also come in var- ious configurations with different head- counts to suit different production, capac- ity, and investment needs. Moreover, capital investment is only one side of the equation for high-end PCBs. e real question is what the machine can help you earn. DI technology enables the produc- Figure 6: 50 micron (2 mil) solder mask dam.

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