Issue link: https://iconnect007.uberflip.com/i/1536435
74 PCB007 MAGAZINE I JUNE 2025 in the early 1970s. ere, he became involved in developing and optimizing the first aque- ous process polymer-based dry film, Lami- nar A. Aqueous dry films were initially used to replace silk screening a circuit image on a layer of a multilayer circuit board. By the mid-1970s, as Dynachem became more involved with IPC, Lionel began attend- ing more IPC meetings and events and joined committees involved with the growing pho- topolymer processing industry. He stayed with Dynachem until the early '80s, when he joined WKK, which had been his customer while at Dynachem. Lionel became a key member of their team, contributing greatly to the advancement of the Asian manufactur- er's proper technical understanding of aque- ous resist specifications: the advantages, pro- cesses, and results in the manufacturing of advanced printed circuits, which had been a significant barrier to their success. As things progressed, his involvement with IPC and Asia expanded beyond just photopolymer- ization, though that did remain a key focus. Eventually, Lionel chaired the IPC com- mittee with whom he had worked for many years, and also became involved in getting IPC standards translated into "world Eng- lish" and/or local languages so that they could be better understood by manufactur- ing populations. For 20 years, he led many of WKK's efforts with IPC, spending 25% of his time on IPC efforts in that field. He wrote 37 technical Lionel Fullwood Inducted into IPC Hall of Fame: 2013 Award Acceptance Speech