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80 PCB007 MAGAZINE I JUNE 2025 unexpected manufacturing challenges. Addi- tionally, the technology helps address critical quality issues, including those related to signal integrity, for smoother and more reliable pro- duction outcomes. Early PCB design adjustments also play a cru- cial role from the etching process perspective 5 , which could be effectively approached using FEM analysis as well. FEM can simulate both the anisotropic and isotropic material removal characteristics of copper during etching, mod- elling how etchant interacts with copper layers while considering variables such as etch rates, temperature, and chemical composition. Such simulations can predict how PCB features like traces, vias, and pads may deform or experi- ence undercutting during the etching process. Using FEM results, designers could define precise etch compensation rules to counter- act material loss and deformation. ese com- pensations involve adjustments to trace width, spacing, and layer thickness in the PCB design soware, ensuring that the desired geometries are achieved aer etching. FEM simulations could further validate the adjusted designs, enabling iterative refinement before manufac- turing. By integrating FEM outputs with opti- mization algorithms, designers could fine- tune compensations across the entire image layer, balancing electrical performance with manufacturability. Digital Twin Technology: A Paradigm Shift Simulation methodology A digital twin model of the copper electro- plating process was developed, incorporat- ing key elements of the plating setup to facil- itate plateability analyses using Finite Ele- ment Analysis (FEA). is approach enables the simulation of current density and copper layer thickness distributions across all active surface areas of a PCB 6,7 . Electroplating sim- ulations are based on Laplace-type models, where the validity and accuracy hinge on the rate of stirring or electrolyte refreshment in the tank. When these rates are sufficient Figure 2: Digital twin concept of the copper electroplating process: The physical process data (input) is used to create a virtual model of the electroplating system. Finite Element (FE) simulations are then con- ducted to analyze the current density and copper layer thickness distribution across the board (results). The simulation results are presented in a color map, where red areas indicate overplated surfaces and blue areas indicate underplated surfaces, highlighting variations in copper thickness.