IPC International Community magazine an association member publication
Issue link: https://iconnect007.uberflip.com/i/1544975
4 I-CONNECT007 MAGAZINE I MAY 2026 Signal Integrity & Metallization Signal integrity and additive manufacturing, particularly metallization, are hot topics in PCB design and fabrication. PCB layouts are carefully engineered to achieve specific electrical and power performance targets. Once the design moves into fabrication, metallization—particularly the plating of traces to precise specifications—is what enables the intended signal integrity to be realized. Features The Chemical Connection 12 The Consequences of Additive Metallizing on Etching Steps by Don Ball 16 Rewriting Metallization, One Ink at a Time with Melbs LeMieux 21 Inkjet Solder Mask: Notion Systems Takes the Mic with Celia Wenzler Articles 48 The AI Tipping Point: Transforming Global Materials Supply Chains by Marcy LaRont 54 From Dilution to ZLD: Optimizing Used Process Water Management by Richard Nichols 60 How New Metals Tariffs Impact the Electronics Industry by James Kim 64 Manufacturing Readiness and Scaling Flex–Packaging Integration, Part 4 by Anaya Vardya 76 Don't Buy AI, Learn It: A Fabricator's Guide to Getting Started, Part 1 by Sean Patterson APRIL 2026 MAY 2026 Direct Metallization: A Strategic Enabler for Advanced PCB Manufacturing by Carmichael Gugliotti 28 63 Roundtable: Data Protection Lays the Groundwork for Cybersecurity Strategies with Hiroyuki Watanabe, Ali Pabrai, and Divyash Patel 68 Shorts Rethinking Reinforcement Materials for Advanced Packaging Fabrication Reality 40 Innovative Flash Copper Plating Technology for Enhanced mSAP Via Reliability, HDI Manufacturing Efficiency, and Advanced Production Control by Andreas Schatz and Mustafa Özkök I-Connect007 Features Marcy's Musings 8 Additive Processes, Signal Consequences by Marcy LaRont WATCH NOW!